Prof. Dohyun Kim (김도현 교수) (Full CV)
Contact Info.
Department of Mechanical Engineering, Myongji University
#216 Engineering I
116 Myongji-ro, Cheoin-gu, Yongin
Gyeonggi-do 449-728
South Korea
Tel: (+82) 31-324-1425, Fax: (+82) 31-330-6957
E-mail: dohyun dot kim at mju dot ac dot kr
Education
2008 Ph.D. Electrical Engineering, University of California, Los Angeles
2001 M.S. Mechanical Engineering, Sogang University
1999 B.S. Mechanical Engineering, Sogang University (Cum Laude)
Appointments
2021.09-present Professor, Department of Mechanical Engineering, Myongji University
2019.09-2020.08 Visiting Associate Professor, Department of Mechanical Engineering, Johns Hopkins University
2016.09-2021.08 Associate Professor, Department of Mechanical Engineering, Myongji University
2012.09-2016.08 Assistant Professor, Department of Mechanical Engineering, Myongji University
2009.12-2012.08 Postdoctoral Scholar,
Bioengineering Department, UC Berkeley
2008.10-2009.11 Postdoctoral Scholar, Center for Embedded Networked Sensing, UCLA
2002.07-2008.10 Research Assistant, Electrical Engineering Department, UCLA
1999.03-2001.07 Research Assistant, Department of Mechanical Engineering, Sogang University
Activity Photos
![]() |
Presentation at the Department of Molecular Science and Technology, Ajou University, Suwon, 2022 |
![]() |
Presentation at the GIGJ(Gyeonggi-Incheon-Gangwon-Jeju) local chapter meeting, The Society of Micro and Nano Systems, Yongin, 2022 |
![]() |
Presentation at the New Tech Forum., The Society of Micro and Nano Systems, Ansan, 2018 |
![]() |
Presentation at the Annual Research Review of Mechanical Engineering Dept., Sogang University, Seoul, 2018 |
![]() |
Presentation at the KSBB-BEST conference, Seoul, 2018 |
![]() |
Presentation at the DGMIF, Daegu, 2018. |
![]() |
A crush course on MEMS for University of Santo Tomas (Philippine) students, KISA, 2017. |
![]() |
Presentation at MEMS 2011 conference, Cancun, Mexico, 2011. |
NEWS
2/10/2026 Hyeona An (안현아), a 2nd-year undergraduate student, joined the BNML. Warm welcome to her.
11/4/025 BNML present a paper titled "UV-adhesive Hybrid Bonding Advances 3D-printed Microfluidics by Enabling Highly Transparent Sub-100-µm Microchannels without Surface Treatment” at the MicroTAS 2025 conference, Adelaide, Austrailia.
10/11/2025 A paper titled “Robust Acoustofluidic Micromixer based on an Ultrathin PDMS Microballoon Oscillator” is published in Sensors and Actuators B: Chemical (Impact Factor 7.1).
10/11/2025 A paper titled “Robust Acoustofluidic Micromixer based on an Ultrathin PDMS Microballoon Oscillator” is published in Sensors and Actuators B: Chemical (Impact Factor 7.1).
7/20/2025 Huiro Yun (윤희로), a 2nd-year undergraduate student, joined the BNML. Warm welcome to him.
7/11/2025 BNML receives a 1-year grant from GBSA (Gyeonggi Busienss & Science Accelerator) for a research project titled "Fully automated flow microscope for high-throughput inspection of biopharmaceuticals"
6/10/2025
The paper "Inhibition of Polymerase Chain Reaction by Hydrogel Monomers" is published to a journal Appled Materials Today (IF 7.2). The research was funded by Samsung Future Technology Forum and collaborated work with Prof. Minsub Chung, Hong-ik University.
4/22/2025
The paper "Thermally Stable and Shape-Adaptive Triboelectric Nanogenerators Based on Liquid Electrolytes with Low Vapor Pressure" is published to a journal Small (IF 13.0). The research was collaboration with Prof. Yong-tae Park.
3/15/2025
Our graduate student Yeji Yang receives the excellent paper award in 2024 KSME conference in Jeju.
3/15/2025
The paper "UV Adhesive Hybrid Bonding for Sub-100-μm DLP-3D-printed Microchannels" is just accepted to the BioChip Journal (IF 5.5).
3/3/2025
Admas Dagnachew Temesgen (아드마스다그나츄테메스젠), an MS-PhD student from Ethiopia, joined the BNML. Warm welcome to him.
1/24/2025
Yonghoo Son (손영후), a 1st-year undergraduate student, joined the BNML. Warm welcome to him.
1/2/2025
Dohyun Park, BNML's undergraduate student, is graduating with a B.S. degree in Mechanical Engineering and got a job in LS Electric.







